Key Specifications/Special Features:

• Layers: 1 to 12
• Base materials: BT, Kapton, G10, FR4 and CEM-3
• Base copper thickness: 1/3 to 3oz
• Minimum thickness:
  • Double sided: 0.10mm/0.004-inch
  • Four layers: 0.40mm/0.016-inch
  • Six layers: 0.55mm/0.022-inch
• Maximum panel size: 406 x 610mm/16 x 24-inch
• Minimum hole diameter: 0.20mm/0.008-inch
• PTH hole tolerance: 0.05mm/0.002-inch
• Aspect ratio: 6:1
• Blind or buried via: yes
• Minimum line width: 0.051mm/0.002-inch
• Minimum line spacing: 0.051mm/0.002-inch
• Minimum bonding pitch: 0.181mm/0.007-inch (center to center)
• Minimum SMT pitch: 0.40mm/0.016-inch (center to center)
• Mechanical fabrication:
  • Minimum hole registration tolerance (NPTH): ±0.025mm
  • Minimum hole registration tolerance (PTH): ±0.075mm
  • Minimum pattern registration tolerance: ±0.05mm
  • Minimum S/M registration tolerance (LPI): ±0.075mm
  • Minimum annular ring: ±0.025mm
  • Minimum S/M bridge (LPI): 0.1mm
  • Plated gold thickness: 0.025um to 3um
  • Sample available
  • Big orders accepted